The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.

Analytical Center for Collective Use Dagestan Federal Research Centre of the Russian Academy of Sciences 367001 Makhachkala Russia

Department of Ceramics and Polymers Faculty of Mechanical Engineering Brno University of Technology Technická 2 616 69 Brno Czech Republic

Department of Inorganic Chemistry and Chemical Ecology Dagestan State University St M Gadjieva 43 a Dagestan Republic 367015 Makhachkala Russia

Department of Physics Faculty of Electrical Engineering and Communication Brno University of Technology Technická 2848 8 616 00 Brno Czech Republic

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