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Ultra-high-speed videography of resin-dentin interface failure dynamics under tensile load
K. Hosaka, A. Tichy, M. Ikeda, K. Nakagawa, A. Sadr, J. Tagami, M. Takahashi, K. Sato, Y. Nishitani, CA. Klein-Junior, DH. Pashley, M. Nakajima,
Language English Country Great Britain
Document type Journal Article, Research Support, Non-U.S. Gov't
- MeSH
- Dentin MeSH
- Dentin-Bonding Agents * MeSH
- Humans MeSH
- Stress, Mechanical MeSH
- Microscopy, Electron, Scanning MeSH
- Tensile Strength MeSH
- Surface Properties MeSH
- Resin Cements MeSH
- Composite Resins MeSH
- Materials Testing MeSH
- Dental Bonding * MeSH
- Check Tag
- Humans MeSH
- Publication type
- Journal Article MeSH
- Research Support, Non-U.S. Gov't MeSH
OBJECTIVES: Ultra-high-speed (UHS) videography was used to visualize the fracture phenomena at the resin-dentin interface during micro-tensile bond strength (μTBS) test. We also investigated whether UHS videography is applicable for failure-mode analysis. METHODS: Ten human mid-coronal dentin surfaces were bonded using Clearfil SE Bond either in self-etching (SE) or etch-and-rinse (ER) mode. After 24-h water storage, the samples were cut into beams for μTBS test and tested at a cross-head speed of 1 mm/min. The fracture phenomena at the bonded interface were captured using a complementary metal-oxide-semiconductor digital UHS camera at 299,166 frames per second. The failure modes were classified using UHS videography, followed by scanning electron microscopy (SEM) analysis. The failure-mode distributions determined by UHS videography and SEM analysis were statistically analyzed using Fisher's exact test with Bonferroni correction. RESULTS: The crack-propagation speed exceeded 1,500 km/h. No significant difference was found between the SEM and UHS videography failure-mode distributions in the SE mode. A significant difference appeared between them in the ER mode. Significant differences in the incidence of cohesive failures within the adhesive and at the adhesive-composite interface between the SE and ER modes were identified by both SEM and UHS videography. SIGNIFICANCE: UHS videography enabled visualization of the fracture dynamics at the resin- dentin interfaces under tensile load. However, the resolution at such high frame rate was insufficient to classify the failure mode as precisely as that of SEM. Nevertheless, UHS videography can provide more detailed information about the fracture origin and propagation.
References provided by Crossref.org
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- $a Hosaka, Keiichi $u Department of Cariology and Operative Dentistry, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University, 1-5-45 Yushima, Bunkyo-ku, Tokyo 113-8510, Japan. Electronic address: hosaka.ope@tmd.ac.jp.
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- $a Ultra-high-speed videography of resin-dentin interface failure dynamics under tensile load / $c K. Hosaka, A. Tichy, M. Ikeda, K. Nakagawa, A. Sadr, J. Tagami, M. Takahashi, K. Sato, Y. Nishitani, CA. Klein-Junior, DH. Pashley, M. Nakajima,
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- $a OBJECTIVES: Ultra-high-speed (UHS) videography was used to visualize the fracture phenomena at the resin-dentin interface during micro-tensile bond strength (μTBS) test. We also investigated whether UHS videography is applicable for failure-mode analysis. METHODS: Ten human mid-coronal dentin surfaces were bonded using Clearfil SE Bond either in self-etching (SE) or etch-and-rinse (ER) mode. After 24-h water storage, the samples were cut into beams for μTBS test and tested at a cross-head speed of 1 mm/min. The fracture phenomena at the bonded interface were captured using a complementary metal-oxide-semiconductor digital UHS camera at 299,166 frames per second. The failure modes were classified using UHS videography, followed by scanning electron microscopy (SEM) analysis. The failure-mode distributions determined by UHS videography and SEM analysis were statistically analyzed using Fisher's exact test with Bonferroni correction. RESULTS: The crack-propagation speed exceeded 1,500 km/h. No significant difference was found between the SEM and UHS videography failure-mode distributions in the SE mode. A significant difference appeared between them in the ER mode. Significant differences in the incidence of cohesive failures within the adhesive and at the adhesive-composite interface between the SE and ER modes were identified by both SEM and UHS videography. SIGNIFICANCE: UHS videography enabled visualization of the fracture dynamics at the resin- dentin interfaces under tensile load. However, the resolution at such high frame rate was insufficient to classify the failure mode as precisely as that of SEM. Nevertheless, UHS videography can provide more detailed information about the fracture origin and propagation.
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- $a Tichý, Antonín $7 xx0247981 $u Department of Cariology and Operative Dentistry, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University, 1-5-45 Yushima, Bunkyo-ku, Tokyo 113-8510, Japan; Institute of Dental Medicine, First Faculty of Medicine of the Charles University and General University Hospital in Prague, Karlovo namesti 32, Prague, 121 11, Czech Republic.
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- $a Ikeda, Masaomi $u Department of Oral Prosthetic Engineering, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University, 1-5-45 Yushima, Bunkyo-ku, Tokyo 113-8510, Japan.
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- $a Takahashi, Masahiro $u Department of Cariology and Operative Dentistry, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University, 1-5-45 Yushima, Bunkyo-ku, Tokyo 113-8510, Japan.
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- $a Nishitani, Yoshihiro $u Department of Operative Dentistry, Kagoshima University Graduate School of Medicine, Dentistry and Pharmaceutical Sciences, 2-5-1 Shikata-cho, Kita-ku, Okayama 700-8525, Japan.
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- $a Klein-Junior, Celso Afonso $u Department of Operative Dentistry, School of Dentistry, Lutheran University of Brazil, Avenue Martinho Lutero, 301. CEP96501-595. Cachoeira do Sul, Rs, Brazil.
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- $a Nakajima, Masatoshi $u Department of Cariology and Operative Dentistry, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University, 1-5-45 Yushima, Bunkyo-ku, Tokyo 113-8510, Japan.
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