Contact resistance between electrically connected parts of electronic elements can negatively affect their resulting properties and parameters. The contact resistance is influenced by the physicochemical properties of the connected elements and, in most cases, the lowest possible value is required. The issue of contact resistance is also addressed in connection with the increasingly frequently used carbon allotropes. This work aimed to determine the factors that influence contact resistance between graphene prepared by chemical vapour deposition and pre-patterned Cu and Au electrodes onto which graphene is subsequently transferred. It was found that electrode surface treatment methods affect the resistance between Cu and graphene, where contact resistance varied greatly, with an average of 1.25 ± 1.54 kΩ, whereas for the Au electrodes, the deposition techniques did not influence the resulting contact resistance, which decreased by almost two orders of magnitude compared with the Cu electrodes, to 0.03 ± 0.01 kΩ.

Department of Physical Chemistry Faculty of Chemical Engineering University of Chemistry and Technology Technicka 5 166 28 Prague Czech Republic

Department of Physics Helsinki University P O Box 43 00014 Helsinki Finland

Faculty of Electrical Engineering University of West Bohemia Univerzitní 2795 8 301 00 Pilsen Czech Republic

J Heyrovsky Institute of Physical Chemistry Academy of Sciences of the Czech Republic Dolejškova 2155 3 182 23 Prague Czech Republic

Tesla Blatná a s Palackého 644 388 01 Blatná Czech Republic

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