This research aimed to study a Bi-Ag-Mg soldering alloy and the direct soldering of Al2O3 ceramics and Ni-SiC composites. Bi11Ag1Mg solder has a broad melting interval, which mainly depends on the silver and magnesium content. The solder starts to melt at a temperature of 264 °C. Full fusion terminates at a temperature of 380 °C. The microstructure of the solder is formed by a bismuth matrix. The matrix contains segregated silver crystals and an Ag (Mg, Bi) phase. The average tensile strength of solder is 26.7 MPa. The boundary of the Al2O3/Bi11Ag1Mg joint is formed by the reaction of magnesium, which segregates in the vicinity of a boundary with a ceramic substrate. The thickness of the high-Mg reaction layer at the interface with the ceramic material was approximately 2 μm. The bond at the boundary of the Bi11Ag1Mg/Ni-SiC joint was formed due to the high silver content. At the boundary, there were also high contents of Bi and Ni, which suggests that there is a NiBi3 phase. The average shear strength of the combined Al2O3/Ni-SiC joint with Bi11Ag1Mg solder is 27 MPa.

Department of Non Ferrous Metals Refining and Recycling FMT Faculty of Materials Science and Technology Technical University of Ostrava 17 Listopadu 15 708 33 Ostrava Czech Republic

Faculty of Materials Science and Technology in Trnava Slovak University of Technology in Bratislava Jána Bottu No 2781 25 917 24 Trnava Slovakia

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